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Perfluoroether rubber compound

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Perfluoroether rubber is the most resistant material to high temperature and chemical solvents among all elastomer sealing materials. It is resistant to chemicals and corrosive media such as strong acids, strong alkalis, ketones, ethers, alcohols, esters, aldehydes, hydrocarbons, nitrogen-containing compounds and amino compounds, which are not resistant to ordinary rubber and fluororubber. Perfluoroether can be widely used in petrochemical industry, chemical industry, pharmaceutical industry, solvent equipment, aerospace equipment, nuclear energy industry according to various working environments and temperatures, especially in the extremely harsh environment of photolithography, chemical etching and chemical cleaning in the production process of semiconductors, which requires extremely high thermal stability and chemical resistance, and perfluoroether can play a great role.

 

Category Details
Composition – Base Polymer: Perfluoroether copolymer (FFKM, e.g., Kalrez®, Chemraz®)
  – Reinforcing Fillers: PTFE (10–30 phr), carbon nanotubes (optional)
  – Curing Agents: Peroxide (DCP, 1–3 phr) or ionic crosslinkers
Physical Properties – Hardness (Shore A): 55–90 (ASTM D2240)
  – Tensile Strength: 8–20 MPa (ASTM D412)
  – Compression Set: <25% (200°C, 70h, ASTM D395)
Thermal Resistance – Service Temperature: -25°C to +327°C (intermittent 350°C)
  – Thermal Stability: <5% weight loss at 300°C (24h, ASTM D573)
Chemical Resistance – Resistant To: Acids, bases, oils, fuels, steam, and plasma
  – Limitations: Molten alkali metals, fluorine gas
Key Applications – Semiconductor: Wafer processing seals, plasma chambers
  – Chemical Processing: Aggressive media seals and diaphragms
  – Aerospace: Rocket propulsion systems and fuel-resistant O-rings
Processing – Mixing: High-temperature internal mixer (>50°C) or two-roll mill
  – Molding: Compression/injection molding (200–250°C, 15–30 MPa)
Storage – Conditions: Dry, <25°C, away from UV/ozone; shelf life 12–18 months
Certifications – Regulatory: FDA 21 CFR 177.2400 (food-grade), SEMI F57 (semiconductor)

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